Samsung’s Newest Chip-on-Board LED Lineup Includes LES COB Packages

global

Samsung Introduces Chip-on-Board LED Packages with Small LES and Advanced Color Quality

Sys-Con Media, June 10, 2015. Image credit: XX2Bek

Samsung Electronics Co., Ltd., a world leader in advanced component solutions, has introduced new chip-on-board (COB) LED package lineups, including small LES (light-emitting surface) COB packages, high CRI (color rendering index) COBs, and vivid COBs. The new COB packages with their outstanding color quality and scaled-down light emitting space, will provide a major design alternative for LED lighting makers.

samsung-led-cob
Samsung LED Small LES Chip-on-Board. Package – LC040C Photo Courtesy of Business Wire.

Samsung has introduced three small LES COB packages (LC010C, LC020C and LC040C) to satisfy the market need for higher light intensity with very small form factors, and two new lineup options to its existing LC Series (LC006B, LC008B, LC013B, LC019B, LC026B, LC033B and LC040B). The new high intensity offerings include LC Series COB packages with a CRI over 95, as well as the Vivid COB LC Series, each of which will deliver premium light quality.

  • Small LES COB LED Packages

Samsung LED’s new Small LES COB packages – LC010C, LC020C and LC040C – offer 10W, 20W and 40W of operating wattage options respectively and significantly reduced dimensions. In the 40W-class LC040C, the diameter of its LES has shrunk to 11mm from the 17mm typically specified in conventional 40W COB packages. For the LC010C and LC020C offerings, the LES scaled down to 6 mm from 11 mm and to 8 mm from 12.4 mm respectively. These LES packages are approximately 35 percent smaller than the LES in most existing COB packages. Moreover, they offer exceptionally high light intensity and even higher Center Beam Candle Power (CBCP) to provide the optimal narrow-beam solution for spotlights.

Read More